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Department of Chemistry College of Liberal Arts and Sciences

Plasma Cleaner

march plasma generator with rf generator, gas flow control system, and sample chamber
EquipmentGCM 100, March
Plasma gas(es)Air
Argon

Plasma cleaning

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Gases are ionized via RF generation producing a plasma that can be used to clean and/or modify material surfaces. The plasma cleaning can microscopically remove contaminants such as organic residue, particulates, and oxidation layers, which can improve bonding and electrical performance.

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Several gases can be used to create this plasma, most commonly argon or oxygen. The benefits of argon plasma is its inert nature that is chemically transparent to the material as well as its hardness that can perform surface roughing or etching as well as cleaning. However, argon has limited cleaning abilities as it is less effective in breaking down organic materials. Oxygen plasma is much better at eliminating organic material and can improve surface adhesion prior to applications relying on bonding, printing, or coating. The process can also introduce surface oxidation, such as introducing hydroxyl (-OH) or carboxyl (-COOH) groups. However, oxygen introduces more mechanical risk, including necessary protections to the equipment to prevent damage, in addition to the explosive dangers.

Currently, air is being applied, containing an appreciable amount of both gases, but being safer to use than pure oxygen. Air plasma effectively removed organic material, dust, and particulates, but may take slightly longer to clean than pure oxygen plasma. Argon plasma is also available in combination with air or alone. At this time, pure oxygen is not available as we have not yet implemented the necessary mechanical protections.

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