| TA Instruments | Q800 |
| Force | 1 mN – 18 N |
| Modulus | 1e3 – 3e12 Pa ± 1% |
| Frequency | 0.01 – 200 Hz |
| Dynamic sample deformation range | 0.5 µm – 10 mm |
| Temperature | -150 – 600 °C |
| Heating rate | 0.1 – 20 °C/min |
| Cooling rate | 0.1 – 10 °C/min |
Dynamic mechanical analysis (DMA) provides information on the thermomechanical properties of a viscoelastic polymer sample. A form of rheology, DMA, provides the storage (E’) and loss (E”) modulus.
Elastic (Young’s) modulus (E) – material stiffness, resistance to deformation; modulus = Stress / Strain
Storage modulus (E’) – material’s ability to store deformation energy elastically
Loss modulus (E”) – deformation energy losses from internal friction when flowing
Loss tangent (tanδ) – damping or index of viscoelasticity
Stress (σ) – measure of force as applied to an area (Force / Area)
Strain (e) – deformation of the material (change in material dimensions / original dimensions)
Mainly used on thin films, the storage and loss moduli can be measured as the temperature is ramped, resulting in the measurement of both thermal and mechanical effects on the material’s physical properties. DMA applies an oscillatory force to the sample which can be strain or stress controlled, normally at a constant frequency of 1 Hz. The DMA utilizes liquid nitrogen to reach cryogenic temperatures allowing for the analysis of nearly all polymers below their glass transition temperatures (Tg) before being able to ramp to a max temperature of 250 °C.
Prior to running samples, understanding some of the principals of the methodology is highly recommended:
**Thermogravimetric analysis (TGA) is required prior to all DMA measurements to get information about the thermal stability of your sample. DMA experiments can only be performed at temperatures below the sample’s 95% decomposition temperature.